Shanghai Fudan Microelectronics Group Co., Ltd. (“Fudan Microelectronics”; Ticker: 688385.SH / 01385.HK), a leading provider of ultra-large-scale integrated circuit design and system solutions, today announced the official global launch of its next-generation Ultra-High Frequency (UHF) RAIN RFID tag chip: the FM13UF0052A (subsequently referred to as “F52A”).

Representing Fudan Microelectronics’ definitive technological answer to next-generation massive-scale IoT deployments, the F52A features comprehensive structural optimizations across its underlying architecture and RF front-end. Delivering generational breakthroughs in bandwidth sensitivity, encoding speed, and high-density batch-reading success rates, the chip is perfectly tailored for all-scenario deployments across apparel retail, warehousing, and logistics.

Overcoming Industry Pain Points: Engineered for Large-Scale, High-Density Extreme Scenarios

As digital transformation deepens across retail, apparel, tire management, and asset tracking, the volume of asset processing and supply chain workflows is expanding exponentially. Traditional RAIN RFID systems face severe bottlenecks—such as data collisions, missed reads, and sluggish data throughput when scanning massive, tightly stacked tag populations—capping overall inventory velocity.

The F52A is a compact, low-capacity RAIN RFID tag chip fully compliant with EPC Global Class1 Gen2V2 and ISO/IEC 18000-63 (Type C) protocols. Compared to widely adopted first-generation predecessors, the F52A delivers generational leaps across three critical dimensions:

  • Optimized High-Density Inventory Performance: Tailored for extreme scenarios—such as high-volume boxed apparel shipments or packed warehouse racks—the F52A exhibits unprecedented multi-tag read success rates, completely mitigating the industry-wide headache of missed reads.
  • Breakthrough Batch-Reading & Encoding Speeds: Specifically engineered for massive concurrent inventory processing. With its highly efficient anti-collision capabilities and accelerated write times, the chip significantly slashes data transmission overhead during initial asset coding and stock check-ins.
  • Industry-Leading Bandwidth Performance: The chip dramatically enhances RF responsiveness and sensitivity across global frequency bands, ensuring stable read ranges and robust link performance even in complex, multi-path interference environments.

To facilitate rapid, seamless commercial scaling for global customers, Fudan Microelectronics paired the F52A with its FM13RD1616 Series Reader Chips. By combining the F52A tag chip, the in-house RD1616 reader IC, and its proprietary MCU portfolio, the company has successfully established an integrated “Tag + Reader + MCU” turnkey solution, providing rock-solid hardware synergy for intelligent supply chains.

Matrix Synergy: A Comprehensive IoT Chip Ecosystem

Beyond the flagship UHF F52A launch, Fudan Microelectronics continues to showcase its multi-industry secure connectivity innovations, driving multi-dimensional digital transformations:

  • Consumables Anti-Counterfeiting: A flexible, three-tiered hardware authentication matrix utilizing cryptographic algorithms and Secure Elements (SE) to safeguard high-value brand equity and hardware integrity.
  • Smart Connectivity: Advanced dual-interface (I2C & contactless) NFC channel ICs featuring enhanced smartphone compatibility and extended read ranges, optimized for electronic shelf labels (ESLs) and smart home devices.
  • Telecom & Automotive Electronics: High-performance industrial/automotive-grade eSIM silicon caters to stringent communication markets, while automotive-grade NFC reader ICs and SE chips have achieved millions of units in cumulative shipments, leading the secure hardware localization market.

About Fudan Microelectronics (Security & Identification Division)

Shanghai Fudan Microelectronics Group Co., Ltd. is China’s pioneer publicly listed IC design enterprise with an “A+H” dual-listing capital structure. Its flagship Security and Identification Division delivers a world-class, trusted IoT hardware portfolio across four core product lines:

  • RFID & NFC: High-performance UHF tag chips (such as the all-new F52A) and dual-interface NFC channel ICs.
  • Reader ICs: Multi-protocol, high-sensitivity contactless reader silicon compliant with both EPC and National GB Standards.
  • Secure CPU Chips: High-security processors deployed at massive scale across global telecommunications (SIM/eSIM), finance, public transit, and smart cards.
  • SE Chips: Automotive-grade (AEC-Q100) certified Secure Elements and anti-counterfeiting chips featuring PUF (Physical Unclonable Function) technology.

Shipped to over 30 countries and regions, the division’s solutions secure hundreds of millions of connected endpoints globally, building a rock-solid silicon foundation for the IoT landscape. For more information, please visit the official corporate website.