About the company
ITEC BV has more than 30 years’ experience with designing and manufacturing high speed die attach equipment for semiconductor and RFID inlay assembly processes. ITEC offers a range of products, including die attach equipment, test and vision equipment, and software solutions for process optimization. ITEC excels at high volume, high speed, and high accuracy semiconductor manufacturing. With an installed base of more than 2,500 of the industry’s most advanced tools, ITEC enables its customers to assemble and test 250 million semiconductors every single day.
ADAT3 XF Tagliner: RFID inlay chip bonding at the highest productivity and quality standard at the lowest cost of ownership
- Unrivalled speed at 48,000 UPH (up to 2 inch product pitch) ensuring high productivity
- High positional and rotational accuracies enabling placement of dies smaller than 200 micron
- Suitable for all commonly used substrate materials including paper
- Unique ultrafast curing process working with only two thermodes
- Automatic wafer change